ARPES resources

Diverse set ups

• Standard “flag-style” sample plates with various mounting options for optimal base temperature, uniaxial strain, and high-temperature sample preparations.
• On the I05-1 micro-ARPES branch, measurements with electrical contacts are possible for work functions, drain current measurements, or sample biasing in a gated geometry.

Dedicated sample preparation methods

In situ sample preparation in ultrahigh vacuum for atomically controlled, clean surfaces:

• Cleavage of layered crystalline materials by knocking off a post glued to the top surface.
• Controlled cleavage of FIB-etched materials with a mechanical arm in situ.
• Vacuum suitcase port for transporting samples under ultrahigh vacuum from the user facility.
• Annealing to remove water vapor and adsorbates (typically for graphene & 2D material samples).
• Ar-ion sputtering and annealing for polished metal surfaces.
• O- or H-plasma cleaning for semiconductor samples.
• Evaporation sources for preparing ultrathin films (with some limitations).
• Port for attaching user-supplied vacuum suitcase.

Expert support and training

• On-site assistance from Diamond’s spectroscopy experts during your experimental time, including help with sample mounting.
• I05 regularly participates in the Diamond summer school. Training is provided both on-site and in advance, with access to in-house analysis scripts available on request or through collaboration with the in-house team.

Supporting measurements

• LEED: Available in multiple chambers, including at low/high temperatures.
• XPS: High-resolution core-level measurements using the beamline (for hv<240 eV). Our sample plates are compatible with some other beamlines and offline facilities for further work.

Dedicated laboratories

Equipped for sample preparation and characterisation work, featuring essential equipment:

• Hot plate and conductive epoxies for traditional sample preparation.
• Dry Argon glove box installed at the beamline for the safe handling of air-sensitive materials, equipped with an optical microscope and manipulation aids for sample preparation. Transfer from the glove box to the beamline without air exposure is possible.
• Wire bonder for electrical connection to contact pads on device samples.
• Optical microscopes to check the suitability of the sample and its orientation.